{"rewrite":{"id":"r_404e8dfd63f566f56d3d7a25","clusterId":"c_90bedd6c7acd7465b0221854","slug":"tsmc-develops-quasi-emib-packaging-to-counter-intel-emib","model":"deepseek-v4-flash:free","headline":"TSMC Develops Quasi-EMIB Packaging to Counter Intel EMIB","summary":"TSMC is developing a new 2.5D packaging technology internally called Quasi-EMIB, based on Intel's EMIB, according to The Information. The technology is reportedly being developed jointly with substrate maker KINSUS. The move comes as Intel's EMIB gains order volume and TSMC's CoWoS remains constrained through 2026.","whyItMatters":"TSMC's Quasi-EMIB signals a direct response to Intel's EMIB gaining traction in AI packaging, while CoWoS capacity stays tight.","webCardHtml":"\u003cp\u003eTSMC\u0026#39;s CoWoS-L uses a separate RDL interposer with embedded local silicon interconnects, requiring two assembly and bonding processes. Intel\u0026#39;s EMIB skips the interposer entirely, embedding fine silicon bridges directly in the organic substrate and placing micro-bumps only at chip-to-bridge edges. Intel\u0026#39;s next-gen EMIB-T adds through-silicon vias for 3D stacking.\u003c/p\u003e\u003cp\u003eAccording to The Information, TSMC\u0026#39;s Quasi-EMIB is based on Intel\u0026#39;s approach and is being developed with KINSUS, a major packaging substrate manufacturer. Details remain unclear, but the project signals TSMC is adapting to competitive pressure in AI chip packaging.\u003c/p\u003e","blueskyPost":"TSMC is developing Quasi-EMIB, a 2.5D packaging tech based on Intel's EMIB, with substrate maker KINSUS. CoWoS stays choked through 2026.","twitterPost":"TSMC is developing Quasi-EMIB, a 2.5D packaging tech based on Intel's EMIB, with substrate maker KINSUS. CoWoS stays choked through 2026.","threadsPost":null,"newsletterBlurb":"TSMC is developing a new 2.5D packaging technology called Quasi-EMIB, based on Intel's EMIB, reportedly with substrate maker KINSUS. The move responds to Intel's EMIB gaining order volume while TSMC's CoWoS remains constrained through 2026.","attributionJson":"[{\"source\":\"GIGAZINE\",\"url\":\"https://gigazine.net/news/20260731-tsmc-quasi-emib/\",\"title\":\"TSMC developing advanced AI semiconductor packaging technology internally called 'Quasi-EMIB', similar to Intel's Embedded Multi-die Interconnect Bridge technology\"}]","lintFlagsJson":null,"lintHits":0,"costUsd":0,"inputTokens":4667,"outputTokens":546,"status":"published","repairAttempts":0,"nextRepairAt":null,"factsAttemptedAt":1786284351,"createdAt":"2026-08-09T14:01:10.000Z","publishedAt":"2026-08-09T14:01:44.000Z","updatedAt":"2026-08-09T14:01:10.000Z"},"cluster":{"id":"c_90bedd6c7acd7465b0221854","canonicalTitle":"TSMCが「準EMIB」と社内で呼ぶ高度なAI半導体パッケージング技術を開発中、IntelのEmbedded Multi-die Interconnect Bridge技術に類似か","representativeArticleId":"a_167051f53d4ed4044fa196b7","sourceCount":1,"writtenSourceCount":1,"writeAttempts":0,"isSolo":true,"entitiesJson":"{\"anime_titles\":[],\"manga_titles\":[],\"work_titles\":[],\"studios\":[],\"people\":[],\"type\":\"news\",\"domain\":\"other\",\"is_roundup\":false}","contentType":"news","status":"published","firstSeenAt":"2026-07-31T12:00:00.000Z","lastSeenAt":"2026-07-31T12:00:00.000Z","updatedAt":"2026-08-09T14:01:44.000Z"},"attribution":[{"source":"GIGAZINE","url":"https://gigazine.net/news/20260731-tsmc-quasi-emib/","title":"TSMCが「準EMIB」と社内で呼ぶ高度なAI半導体パッケージング技術を開発中、IntelのEmbedded Multi-die Interconnect Bridge技術に類似か"}],"entities":{"anime_titles":[],"manga_titles":[],"work_titles":[],"studios":[],"people":[],"type":"news","domain":"other","is_roundup":false},"keyFacts":null}